NDLI: The effect of oxygen partial pressure during heat treatment on the microstructure of dip-coated Bi-2212/Ag and Ag alloy tapes

Content Provider	IEEE Xplore Digital Library
Author	Fujii, H. Kumakura, H. Kitaguchi, H. Togano, K. Wei Zhang Yi Feng Hellstrom, E.E.
Copyright Year	2002
Abstract	The evolution of the microstructure during heat treatment was investigated for dip-coated Bi/sub 2/Sr/sub 2/CaCu/sub 2/O/sub y/(Bi-2212)/Ag and Ag alloy tapes as a function of temperature and oxygen partial pressure (P(O/sub 2/)=0.01, 0.21 and 1 atm) using quenched and fully-processed tapes. The microstructures were essentially the same for Bi-2212 on pure Ag and on the Ag alloy, Although the melting temperature of Bi-2212 increased with increasing P(O/sub 2/), the solidification temperature (T/sub sol/) of Bi-2212 for P(O/sub 2/)=0.21 atm was higher than that for P(O/sub 2/)=1 atm. The volume fraction and grain alignment of Bi-2212 processed in P(O/sub 2/)=0.01 atm was smaller than in tapes processed in 0.21 and 1 atm, which were quite similar. HR-TEM studies on grain boundaries and AC susceptibility measurements suggest that the higher critical current density(J/sub c/) for tapes processed in P(O/sub 2/)=1 atm than that for 0.21 atm is due to improved coupling of the grains.
Sponsorship	Council on Superconductivity Appl. Superconductivity Conference Inc MIT
Starting Page	1707
Ending Page	1710
Page Count	4
File Size	1081740
File Format	PDF
ISSN	10518223
Volume Number	7
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-06-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Oxygen Heat treatment Microstructure Temperature Scanning electron microscopy Magnetic field measurement Grain boundaries X-ray imaging Superconductivity Density measurement
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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