NDLI: The optimization of a refrigeration vapor compression system for power microelectronics

Content Provider	IEEE Xplore Digital Library
Author	Chiriac, V. Chiriac, F.
Copyright Year	2006
Description	Author affiliation: Freescale Semicond. Inc., Tempe, AZ (Chiriac, V.)
Abstract	The study develops an analytical model of an optimized small scale refrigeration system using vapor compression, with application to the cooling of the electronic components populating a printed circuit board (PCB) in a high-power microelectronics system. The author's previous study (Chiriac and Chiriac, 2005) evaluated a vapor compression system using an off-the-shelf compressor and associated components, focusing mainly on the thermal feasibility of the non-optimized mechanical refrigeration system and on-chip system-level incorporation. Present investigation focuses on the miniaturization of the evaporator micro-channel structures, designed to fit smaller packages populating PCB. The design takes into account the miniaturized refrigeration system components, and is optimized to address the appropriate power dissipation ranges. The study uses the R-134s refrigerant, which provides the best COP/feasibility ratio, while being the most suitable for microelectronics applications (Phelan et al., 2004). Various micro-channel designs are considered while miniaturizing the evaporator to be incorporated in the vapor compression system. The efficiency of the proposed system is evaluated for various structures, and the optimal design is further identified and compared to previous designs using mechanical compression cooling. The advantages of the optimized refrigeration design are highlighted, establishing a performance vs. size relationship for vapor-compression refrigerators, to serve as the basis for the enhanced cooling of future miniaturized refrigeration applications
Starting Page	6
Ending Page	764
File Size	335825
Page Count	759
File Format	PDF
ISBN	0780395247
ISSN	10879870
DOI	10.1109/ITHERM.2006.1645422
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Refrigeration Microelectronics Design optimization Analytical models Electronics cooling Electronic components Printed circuits Electronic packaging thermal management System-on-a-chip Power dissipation
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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