NDLI: Effect of variation in heat flux at leading portion on a PCB subjected to natural convection cooling in air

Content Provider	IEEE Xplore Digital Library
Author	Yadav, V. Kant, K.
Copyright Year	2006
Description	Author affiliation: Dept. of Mech. Eng., Auckland Univ. (Yadav, V.)
Abstract	With the progressive miniaturization in circuit integration technology in the electronic industry, efforts are being made to design and develop printed circuit boards (PCBs) with the ability to mount IC packages that dissipate heat fluxes of higher order of magnitude. It is interesting to study various possible temperature and heat flux distribution at the PCB surfaces. Exploring the effect of one heated zone or portion upon the rest of the board needs intense modeling efforts. In a vertical channel configuration created using a pair of PCBs, subjected to natural convection cooling in air, the effect of variation in heat flux at the a portion of PCB upon the heat fluxes in the down stream PCB zones kept at uniform wall temperature (UWT) is given consideration in the present work. Few relationships based upon scale analysis have been derived for better understanding of trends in distribution of heat flux and surface temperature over UWT and UHF regions respectively. Experimental data for the values of surface heat flux in the down stream region for different fluxes at the upstream zones are presented and compared with the obtained numerical results. Data is useful in evaluating best component layout at the PCB surface in general and, in particular, selecting proper location for a component with given thermal characteristics if a portion of PCB is already populated or being reserved for a particular heat flux load
Starting Page	12
Ending Page	744
File Size	537380
Page Count	733
File Format	PDF
ISBN	0780395247
ISSN	10879870
DOI	10.1109/ITHERM.2006.1645419
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Cooling Heat transfer Printed circuits Thermal conductivity Heat engines Mechanical engineering Temperature distribution UHF circuits Thermal expansion Strips
Content Type	Text
Resource Type	Article

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