NDLI: A study of degradation of ACF joints in chip-on-glass assenblies

Content Provider	IEEE Xplore Digital Library
Author	Lin, Y.C. Xu Chen Wang, Z.P.
Copyright Year	2006
Description	Author affiliation: Sch. of Mech. & Electr. Eng., Central South Univ., Changsha (Lin, Y.C.)
Abstract	The epoxy-based anisotropic conductive adhesive films (ACF) joints have been widely used in a number of interconnect applications, including direct chip attachment, i.e. chip on glass, chip on ceramics, etc. However, the ACF joints have the potential of being exposed to relative high humidity environment and susceptible to moisture sorption, especially in the elevated temperature. In this study, the hygrothermal environment (85C/85%RH) test was used as an accelerator for the degradation of ACF joints in chip-on-glass (COG) assemblies, which were designed in the form of the single-lap joints. The effects of aging on the adhesion strengths were measured by shear mode tests at the accelerated aging time of 125, 250, 375 and 550 hours, respectively. In order to further interpret the hygrothermal-induced damage from the view of mechanics, the analytical model is established through introducing one factor of the interfacial fracture energy damage. It can be concluded that the long-term hygrothermal aging can irrevocably damage the epoxy system, physically (plasticization, as well as the formation of cracks and crazes) and/or chemically (hydrolysis). Furthermore, the absorbed moisture can attack the adhesive/inorganic substrates interfaces and the hydrolysis occurs in the interfacial region
Starting Page	826
Ending Page	832
File Size	430857
Page Count	7
File Format	PDF
ISBN	0780395247
ISSN	10879870
DOI	10.1109/ITHERM.2006.1645432
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Degradation Moisture Testing Aging Anisotropic magnetoresistance Conductive adhesives Anisotropic conductive films Glass Ceramics Humidity
Content Type	Text
Resource Type	Article

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