NDLI: Fracture mechanical life-time investigation of glass frit-bonded sensors

Content Provider	IEEE Xplore Digital Library
Author	Petzold, M. Dresbach, C. Ebert, M. Bagdahn, J. Wiemer, M. Glien, K. Graf, J. Muller-Fiedler, R. Hofer, H.
Copyright Year	2006
Description	Author affiliation: Fraunhofer Inst. for Mech. of Mater., Halle (Petzold, M.; Dresbach, C.; Ebert, M.; Bagdahn, J.)
Abstract	The long-term mechanical stability of the wafer level package is an important aspect in the reliability approach of MEMS products. Glass frit bonding is one of the most widely used bonding technologies. Since the glass frit bond frame is subjected to thermal stresses due to different thermal expansion coefficients of glass and silicon it constitutes a potential weak link of the package. Therefore, a reliability approach of a glass frit bonded MEMS device has to consider carefully its possible long term failure mechanisms. In particular, crack corrosion of the glass intermediate layer might lead to delayed failure of the device. In this paper, newly developed fracture mechanical measurement techniques as well as the numerical modeling of the experiments that allow determination of the fracture toughness and the crack growth rates of glass frit bonded micro samples are presented. A first fracture mechanical lifetime approach based on subcritical crack growth of initial defects in the glass frit bond frame is discussed. The obtained results form the basis for the lifetime prediction of glass frit bonded MEMS devices
Starting Page	1343
Ending Page	1348
File Size	648364
Page Count	6
File Format	PDF
ISBN	0780395247
ISSN	10879870
DOI	10.1109/ITHERM.2006.1645501
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Glass Mechanical sensors Wafer bonding Thermal stresses Packaging Thermal expansion Microelectromechanical devices Stability Wafer scale integration Micromechanical devices
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Effect of passivation on frit glass bonding method for wafer level hermetic sealing on MEMS devices

Determination of residual stress in glass frit bonded MEMS by finite element analysis

Critical challenges in packaging MEMS devices

Wafer-level packaging technology for MEMS

Wafer level packaging of MEMS

Wafer level glass frit bonding for MEMS hermetic packaging

Wafer Level Hermetic Packaging of MOEMS Devices

Si via interconnection technique for 3D MEMS package

Incrementally etched electrical feedthroughs for wafer-level transfer of glass lid packages

Fracture mechanical life-time investigation of glass frit-bonded sensors

Similar Documents

Effect of passivation on frit glass bonding method for wafer level hermetic sealing on MEMS devices

Determination of residual stress in glass frit bonded MEMS by finite element analysis

Critical challenges in packaging MEMS devices

Wafer-level packaging technology for MEMS

Wafer level packaging of MEMS

Wafer level glass frit bonding for MEMS hermetic packaging

Wafer Level Hermetic Packaging of MOEMS Devices

Si via interconnection technique for 3D MEMS package

Incrementally etched electrical feedthroughs for wafer-level transfer of glass lid packages

Fracture mechanical life-time investigation of glass frit-bonded sensors