NDLI: Designing a mesoscale vapor-compression refrigerator for cooling high-power microelectronics

Content Provider	IEEE Xplore Digital Library
Author	Phelan, P.E. Swanson, J. Chiriac, F. Chiriac, V.
Copyright Year	2004
Description	Author affiliation: Dept. of Mech. & Aerosp. Eng., Arizona State Univ., USA (Phelan, P.E.; Swanson, J.)
Abstract	A mesoscale vapor-compression refrigerator is defined here as one that is /spl sim/5 cm or smaller in size. Such a refrigerator could then be integrated in high-power microelectronics packaging, and thus offer a new cooling solution. To begin the process of designing such a small-scale vapor-compression refrigerator, a comparison of three different refrigerants was carried out, revealing that ammonia (NH/sub 3/) leads to the most efficient refrigerator. From there, a review and discussion of five types of compressors shows that a scroll compressor appears to be the most promising candidate for miniaturizing down to the /spl sim/5 cm size. This information was used to design three realistic vapor-compression refrigerators-for heat loads of 100, 200, and 300 W-using commercially-available scroll compressors and easily-fabricated heat exchangers. These design calculations demonstrate that, for a 100-W vapor-compression refrigerator, an air-cooled condenser can be made as small as almost 5 cm on a side, but that the compressor is still about 15 cm in its maximum dimensions. Thus, it is suggested that future research work concentrate on miniaturizing the compressor, to allow the entire system to fit within the /spl sim/5 cm size limit.
Sponsorship	Components, Packaging and Manufacturing Technol. Soc. of the Inst. of Elec. and Electron. Eng
Starting Page	218
Ending Page	223
File Size	520474
Page Count	6
File Format	PDF
ISBN	0780383575
DOI	10.1109/ITHERM.2004.1319177
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-06-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Refrigeration Microelectronics Compressors Refrigerants Temperature Costs Electronics cooling Thermoelectricity Electronics packaging Thermal management of electronics
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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