NDLI: Small scale refrigeration system for electronics cooling within a notebook computer

Content Provider	IEEE Xplore Digital Library
Author	Mongia, R. Masahiro, K. DiStefano, E. Barry, J. Chen, W. Izenson, M. Possamai, F. Zimmermann, A. Mochizuki, M.
Copyright Year	2006
Description	Author affiliation: Intel Corp., Santa Clara, CA (Mongia, R.; Masahiro, K.; DiStefano, E.)
Abstract	The cooling of high power components in notebook computers is uniquely challenging due to space constraints that limit the size of the thermal solution. As a result, for some applications, a method of inserting a "negative" thermal resistance into the heat flow path may be required in order to achieve higher component powers. In this paper we describe a small-scale refrigeration system for the cooling of high power components in notebook form factors. The small-scale refrigeration system includes a compressor, cold plate, condenser, and throttling device. These components are designed for a vapor-compression cycle with iso-butane as the working fluid. All of these components are designed such that the entire system can be incorporated within a notebook form factor. In order to achieve the targeted performance, the cold plate and condenser contain microchannels to efficiently transfer heat to and from the refrigerant. Prototypes of each of the components were built and tested in order to assess their individual performance. A complete form factor loop was also built and tested in order to determine overall system feasibility and performance. The test results show that the targeted performance of the system (COP > 2.25) is achievable in this form factor at the moderate temperature rise expected in this application
Starting Page	751
Ending Page	758
File Size	485479
Page Count	8
File Format	PDF
ISBN	0780395247
ISSN	10879870
DOI	10.1109/ITHERM.2006.1645421
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Refrigeration Electronics cooling Thermal resistance Cold plates System testing Space cooling Application software Resistance heating Microchannel Heat transfer
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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