NDLI: An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration

Content Provider	IEEE Xplore Digital Library
Author	Chiriac, F. Chiriac, V.
Copyright Year	2007
Description	Author affiliation: Dept. of Thermodynamics, Heat & Mass Transfer, Tech. Univ. of Civil Eng., Bucharest (Chiriac, F.)
Abstract	Classical refrigeration using vapor compression has been widely applied over the last decades to large-scale industrial systems, with few known applications to the microelectronics cooling field, due to the small size limitation. The present study proposes an efficient mechanical refrigeration system to actively cool the electronic components populating a printed circuit board in high-power microelectronics system. The proposed system includes several miniaturized components - compressor, evaporator, condenser - part of a refrigeration system designed to fit the smaller scale power electronics. The system is thermally optimized to reach high COP (coefficients of performance). An array of micro-channels is used for the evaporator/condenser units. A previous study indicated that the R-134s refrigerant provides the best COP/feasibility ratio, while being the most suitable for microelectronics applications (Phelan et al., 2004). The present study develops an analytical model of the proposed small scale vapor compression refrigerator using the R-134a refrigerant. The refrigeration system is thermally optimized for cooling powers ranging from 20 - 100W, with the COP of the system reaching values up to 4.5. In the final section of the study, the efficiency of the proposed system is further compared to existing active cooling techniques using thermoelectric coolers (TEC). The advantages of the proposed system are highlighted, establishing a baseline performance vs. size relationship for vapor-compression refrigerators, to serve as the basis for comparison for future miniaturized refrigeration systems
Starting Page	103
Ending Page	109
File Size	312238
Page Count	7
File Format	PDF
ISBN	1424408962
DOI	10.1109/THETA.2007.363417
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-01-03
Publisher Place	Egypt
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Analytical models Electronics cooling Printed circuits Electronic components Power electronics Microelectronics Large-scale systems Refrigeration Refrigerants Thermoelectricity
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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