NDLI: IMC consideration in FEA simulation for PB-free solder joint reliability

Content Provider	IEEE Xplore Digital Library
Author	Fa-Xing Che Pang, J.H.L. Xu, L.H.
Copyright Year	2006
Description	Author affiliation: Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore (Fa-Xing Che; Pang, J.H.L.; Xu, L.H.)
Abstract	Thermal cycling reliability test and analysis for PBGA components with Sn-3.8Ag-0.7Cu Pb-free solder joints with Cu-OSP and ENIG surface finish were conducted. Failure mode after test was analyzed using cross section and optical microscope. From the test result, a two-parameter Weibull distribution failure model was used to determine the mean-time-to-failure (MTTF) for the PBGA solder joints. FEA simulation using quarter model and submodeling method was implemented to study stress strain behavior of Pb-free solder joints. In this study, finite element analysis modeling of solder joint reliability has been developed to model the effect of intermetallic compound (IMC) layer on solder joint fatigue behavior. Nano-indentation material properties for IMC layer and advanced material constitutive models such as viscoplastic model and the elastic-plastic-creep (EPC) model for lead-free solder are employed. Intermetallic compound (IMC) properties such as $Cu_{6}Sn_{5},$ CuNiSn and $Ni_{3}Sn_{4}$ were modeled with different IMC layer thicknesses in order to study the effect of IMC layer on fatigue life of the solder joint. It is shown that the IMC layer reduces the fatigue life of solder joints compared to the case without considering IMC layer. Thicker IMC layer leads to less fatigue life prediction than thinner IMC layer. The effect of Young's modulus of IMC on stress strain behavior of solder was also carried out
Starting Page	1018
Ending Page	1023
File Size	826686
Page Count	6
File Format	PDF
ISBN	0780395247
ISSN	10879870
DOI	10.1109/ITHERM.2006.1645456
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Fatigue Testing Optical microscopy Stress Capacitive sensors Intermetallic Environmentally friendly manufacturing techniques Lead Tin
Content Type	Text
Resource Type	Article

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