NDLI: Design, fabrication and test of silicon heat pipes with radial microcapillary grooves

Content Provider	IEEE Xplore Digital Library
Author	Ivanova, M. Lai, A. Gillot, C. Sillon, N. Schaeffer, C. Lefevre, F. Lallemand, M. Fournier, E.
Copyright Year	2006
Description	Author affiliation: CEA-DRT - LETI/DIHS/LTPI, Grenoble (Ivanova, M.; Lai, A.; Gillot, C.; Sillon, N.)
Abstract	The miniaturization and improving performance of electronic devices has lead to increasing power densities in electronic systems. Consequently, the thermal environment has become a main issue in their performance and reliability. The use of flat miniature heat pipes has been investigated for transferring the heat over distances or to spread it over a larger surface area to avoid hot spots on the device. The interest of silicon etching techniques for heat pipe manufacturing is that such heat pipes can be very compact, very light and have better heat transfer capacities than metallic heat pipes. In this paper the structure of a flat radial structure silicon heat pipe is presented. A one dimensional two-phase flow model has been developed in order to optimize the performances of the radial grooved silicon heat pipe. Then an experimental study investigates the thermal performance of a realized prototype. The thermal transfer capacities achieved are in the range 50-70 W depending on the working temperature
Starting Page	545
Ending Page	551
File Size	515100
Page Count	7
File Format	PDF
ISBN	0780395247
ISSN	10879870
DOI	10.1109/ITHERM.2006.1645392
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fabrication Testing Silicon Heat transfer Power system reliability Etching Manufacturing Prototypes Temperature dependence Temperature distribution
Content Type	Text
Resource Type	Article

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