NDLI: A novel technique for modeling solder joint failure during system level drop simulations

Content Provider	IEEE Xplore Digital Library
Author	Carroll, D. Bates, C. Zampino, M. Jones, K.
Copyright Year	2006
Description	Author affiliation: iDEN Mech. Design Center, Motorola (Carroll, D.; Bates, C.; Zampino, M.; Jones, K.)
Abstract	This paper will describe a newly developed solder model that can accurately predict solder failure during a full product level drop. Currently, it is not feasible to include a detailed model of the solder ball assembly in a system level drop. Simple calculations show that the mesh count would exceed 10 million nodes just for the solder balls on a typical cellular phone printed circuit board! This has lead to the investigation of various techniques to replace the detailed solder joint model with a computationally simple form. The most promising approach is using an equivalent beam element, whose properties are generated from a detailed model. To ensure the mechanical response of the solder, experimentally obtained rate dependent material properties for lead-free solder data are used, along with a failure criterion based upon the pad finish and solder ball chemistry. Simulations of dynamic 4-pt bend testing have validated this technique and bounded the failure criterion consistent with the literature. Application of the modeling technique has allowed for solder ball failure prediction in fully populated cellular radio drop models and these results will form the basis of this paper
Starting Page	861
Ending Page	868
File Size	800476
Page Count	8
File Format	PDF
ISBN	0780395247
ISSN	10879870
DOI	10.1109/ITHERM.2006.1645437
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Predictive models Environmentally friendly manufacturing techniques Lead Assembly systems Cellular phones Printed circuits Computational modeling Chemical elements Material properties
Content Type	Text
Resource Type	Article

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