NDLI: Degradation of thermal performance of ball grid arrays after thermal cycling

Content Provider	IEEE Xplore Digital Library
Author	Knight, R.W. Elkady, Y. Suhling, J.C. Lall, P.
Copyright Year	2006
Description	Author affiliation: Center for Adv. Vehicle Electron., Auburn Univ., AL (Knight, R.W.; Elkady, Y.; Suhling, J.C.; Lall, P.)
Abstract	The thermal performance of ball grid array packages depends upon many parameters including die size, use of thermal balls, number of perimeter balls, use of underfill, and printed circuit board heat spreader and thermal via and spreader design. Thermal cycling can affect the integrity of thermal paths in and around the BGA as a result of the cracking of solder balls and delamination of the package, including at underfill interfaces. In this study, the impact of thermal cycling on the thermal performance of BGA's was investigated and quantified. A number of test boards which included a range of the parameters cited above were experimentally examined. A baseline thermal resistance was measured for each case, which was verified with numerical thermal modeling. The boards were then subjected to thermal cycling from -40degC to 125degC. Every 250 cycles the thermal performance was measured. Packages expected to be least reliable (with large die and no underfill), showed an increase in thermal resistance after 750 thermal cycles. Further increases in thermal resistance were observed with continuous thermal cycling until solder joint failure occurred at 1250 cycles, preventing additional measurements. The correlation between thermal cycling and thermal resistance was then analyzed using a numerical structural simulation model that predicted crack initiation in the solder joints. The first observed thermal resistance increase occurred in close proximity to the number of cycles where the finite element model predicted initiation of cracking in the thermal solder balls
Starting Page	833
Ending Page	841
File Size	910784
Page Count	9
File Format	PDF
ISBN	0780395247
ISSN	10879870
DOI	10.1109/ITHERM.2006.1645433
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal degradation Electronics packaging Thermal resistance Electrical resistance measurement Predictive models Numerical models Soldering Printed circuits Delamination Testing
Content Type	Text
Resource Type	Article

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Causes of Degradation of Thermal Performance of Ball Grid Arrays After Thermal Cycling

Thermal fatigue reliability enhancement of plastic ball grid array (PBGA) packages

Numerical analysis of an array of ball grid components

Effects of Underfills on the Thermal-Cycling Tests of SnAgCu PBGA (Plastic Ball Grid Array) Packages on ImAg PCB (Printed Circuit Board)

The reliability of plastic ball grid array package

Thermal performance of flip chip ball grid array packages

Development of effective compact models for depopulated ball grid array packages

Board-level solder joint reliability analysis of thermally enhanced BGAs and LGAs

An experimental investigation on the correlation between testing cycles and delamination of plastic ball grid array packages under thermal cycling with high humidity

Degradation of thermal performance of ball grid arrays after thermal cycling

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