NDLI: Optimization of thermoelectric cooling for microelectronics

Content Provider	IEEE Xplore Digital Library
Author	Taylor, R.A. Solbrekken, G.L.
Copyright Year	2006
Description	Author affiliation: Missouri Univ., Columbia, MO (Taylor, R.A.; Solbrekken, G.L.)
Abstract	The electronics industry has traditionally cooled critical components using a simple fan/heat sink assembly. Each advance in IC fabrication technology has resulted in the need for a higher performance thermal solution, stressing the limits of conventional fan/heat sink technology. A possible solution to relieve the pressure being placed on future fan/heat sink technology is to incorporate thermoelectric (TE) cooling into the configuration. It has been established that when using TE technology in electronic applications the entire system needs to be optimized simultaneously. This study is an expansion of previous work as it provides an analytic expression for the TE element geometry that minimizes the junction temperature in an electronic application. Further, it is shown that a minimum junction temperature and a maximum COP can be simultaneously achieved by optimizing both the applied current and the TE geometry. Experimental measurements on commercial TE modules are presented that validate the 1-dimensional thermal-electric models. The measurements precisely match predictions if temperature dependent material properties are used in the models. A model based case study suggests that up to ~100 W can be dissipated using a 0.4 K/W heat sink and an optimized bismuth-telluride TE module while maintaining a 85 degC junction temperature
Starting Page	8
Ending Page	490
File Size	449250
Page Count	483
File Format	PDF
ISBN	0780395247
ISSN	10879870
DOI	10.1109/ITHERM.2006.1645383
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermoelectricity Microelectronics Tellurium Heat sinks Temperature Electronics cooling Geometry Electronics industry Assembly Fabrication
Content Type	Text
Resource Type	Article

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