NDLI: Thermal imaging for detecting thermal interface issues in assembly and reliability stressing

Content Provider	IEEE Xplore Digital Library
Author	Gupta, A. Yongmei Liu Zamora, N. Paddock, T.
Copyright Year	2006
Description	Author affiliation: Design Process Dev., Intel Corp., Chandler, AZ (Gupta, A.)
Abstract	This paper describes the development of a non-destructive thermal imaging technique to detect thermal interface material defects in integrated heat spreader in advanced microprocessors. This technique allows capturing the surface infrared emission response as a function of time using high speed infrared camera. The infrared response of the surface of the integrated heat spreader is captured immediately after powering up the silicon die internally or applying pulsed external heating to the surface. With the presence of thermal interface material defects, the heat flow is disrupted and is reflected on the surface thermal distribution of integrated heat spreader. Since the thermal response of the heat spreader is affected by the thermal interface material defects underneath, the technique can be used to evaluate thermal interface material defects and thermal degradation. We show the successful application of this technique to capture various types of artificially created defects such as voiding. We also show that post thermally cycling and stressing, the thermal signature degrades for all units tested. This paper discusses the results obtained using the internal die heating only as it provided better results for all cases, as compared to pulsed external heating
Starting Page	4
Ending Page	945
File Size	267393
Page Count	942
File Format	PDF
ISBN	0780395247
ISSN	10879870
DOI	10.1109/ITHERM.2006.1645447
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal stresses Assembly Infrared heating Optical imaging Response surface methodology Thermal degradation Microprocessors Cameras Silicon Testing
Content Type	Text
Resource Type	Article

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