NDLI: Effects of Adhesive on Silicon Microgyroscopes

Content Provider	IEEE Xplore Digital Library
Author	Qin Shi Anping Qiu Yan Su Xinhua Zhu
Copyright Year	2007
Description	Author affiliation: Dept. of Sch. of Mech. Eng., Nanjing Univ. of Sci. & Technol. (Qin Shi; Anping Qiu; Yan Su; Xinhua Zhu)
Abstract	The silicon microgyroscopes are very sensitive to the residual stresses, which degrade the microgyroscopes performance. This study used finite element analysis to simulate the residual stresses induced during the packaging process. The silicon microgyroscope is fabricated with SOG (silicon-on-glass) technology and packaged with ceramic packages. FEM simulation based on a simplified structure of the packaged gyroscope was applied in static analyses in order to find out the affections of adhesive on the thermal stresses during the packaging process. The simulation results show that the Young's modulus of adhesive has influence on thermal stresses. When the height of the adhesive layer is above 60 microns and the plane dimension of adhesive layer is larger than that of microgyroscope chip, the stress is small.
Starting Page	92
Ending Page	95
File Size	3286541
Page Count	4
File Format	PDF
ISBN	1424406102
DOI	10.1109/NEMS.2007.352224
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-01-16
Publisher Place	Thailand
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon Packaging Thermal stresses Wafer scale integration Residual stresses Thermal expansion Ceramics Gyroscopes Finite element methods Glass Young's modulus silicon microgyroscopes thermal stress finite element analysis adhesive
Content Type	Text
Resource Type	Article

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