NDLI: Thermal and mechanical considerations for a liquid-cooled high-fluence electron-beam transmission window

Content Provider	IEEE Xplore Digital Library
Author	Vidmar, R.J.
Copyright Year	1998
Description	Author affiliation: Nebec Eng. Services Inc., Campbell, CA, USA (Vidmar, R.J.)
Abstract	Summary form only given. A transmission window at an atmospheric pressure to vacuum interface has both thermal loading due to energy loss from electrons passing through the window and mechanical loading due to atmospheric pressure. Thermal loading during continuous operation limits the beam current because heating reduces the mechanical strength of the window material. A technique using water under high pressure in capillary channels has been demonstrated and can provide cooling of /spl sim/2.8 kW/cm/sup 2/. This cooling can be incorporated, within an electron beam transmission window to increase current loading several orders of magnitude. Heat in the window is conducted to capillary channels and then convectively transferred to water. As water within capillary channels transits the window, its temperature, convective heat transfer coefficient, and vapor pressure all increase. A mechanical design based on mechanical properties at a temperature below the triple-point of water suggests that a window thickness of 1.87.4 /spl mu/m is sufficient to span a 5-cm circular aperture. Computer modeling of heat transfer in a capillary channel is discussed, as well as a window design that can support heat dissipation of 2.8 kW/cm/sup 2/. At 500 keV this window would dissipate 14.7% of the total incident beam power but could maintain a continuous beam current of 30 mA/cm/sup 2/.
File Size	109463
File Format	PDF
ISBN	0780347927
ISSN	07309244
DOI	10.1109/PLASMA.1998.677784
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-06-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Heat transfer Thermal loading Cooling Water heating Temperature Elementary particle vacuum Energy loss Electron beams Mechanical factors Apertures
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Condensed Matter Physics Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in