NDLI: Microstructure and properties of environmental-friendly Sip/1199Al composites used for electronic packaging

Content Provider	IEEE Xplore Digital Library
Author	Ziyang Xiu Guoqin Chen Zongquan Deng Gaohui Wu
Copyright Year	2008
Description	Author affiliation: Res. Acad. of Sci. & Technol., Harbin Inst. of Technol., Harbin (Ziyang Xiu)
Abstract	Sip/1199Al composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. The microstructure observation showed that the composites were dense and Si particles distributed uniformly; The linear CTEs of Sip/1199 composites was between (8.1~12) times $10^{-6}degC^{-1},$ and they were decreased with the increasing content of Si particles as well as annealing treatment; the thermal conductivity can reach 150 W/ (mmiddotdegC), which was decreased with the increasing contents of Si particles as well as annealing treatment. The composites had excellent mechanical properties and also could be recycled.
Starting Page	1
Ending Page	3
File Size	434897
Page Count	3
File Format	PDF
ISBN	9781424427390
DOI	10.1109/ICEPT.2008.4607091
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-07-28
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Metals Silicon Electronic packaging thermal management Thermal conductivity Materials Mechanical factors Annealing
Content Type	Text
Resource Type	Article

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Microstructure and properties of environmental-friendly Sip/1199Al composites used for electronic packaging