NDLI: Study on non-uniformity of Through-Mask electroplated Ni thin-film

Content Provider	IEEE Xplore Digital Library
Author	Jun Tang Hong Wang Rui Liu Shengping Mao Xiaolin Zhao Guifu Ding
Copyright Year	2008
Description	Author affiliation: Res. Inst. of Micro/Nano Sci. & Technol., Shanghai Jiao Tong Univ., Shanghai (Jun Tang; Hong Wang; Rui Liu; Shengping Mao; Xiaolin Zhao; Guifu Ding)
Abstract	Through-mask electroplating has been widely used in the fabrication of chips, BGA substrates and PCBs etc. The uniformity of plating thin-film is the major factor contributed to the reliability of the products. Currently, it is usually by setting optimum plating parameters and adopting electrochemical method to achieve the uniformity of plating. However, the problem of non-uniform distribution of electric field, which is the major cause of the non-uniformity of the plating thin-film, has not been solved. In this paper, finite element method (FEM) was developed to analyze the non-uniform distribution of electric field under different conditions in the process of electroplating. The results show that different thickness of photo-resist and size of electroplating cell are two major factors contribute to the uniformity of plating thin-film. The uniform of electroplating cell can be improved by adding in-chip auxiliary electrode. Also better uniformity of the plating film in radial direction can achieved by setting a shield in the proper position of the plating solution and annular out-chip auxiliary electrode (Cu) around the wafer. The simulation results were consistent with experimental results, which proved that finite element method is an effect way to simulate the electroplating process.
Starting Page	1
Ending Page	4
File Size	3733082
Page Count	4
File Format	PDF
ISBN	9781424427390
DOI	10.1109/ICEPT.2008.4606993
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-07-28
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electrodes Finite element methods Electric fields Simulation Distance measurement Films Semiconductor device modeling Uniformity of Thickness Through-Mask Electroplating Finite Element Method (FEM)
Content Type	Text
Resource Type	Article

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