NDLI: The humidity and thermal characteristics of die-attach (DA) and its impact on the package reliability

Content Provider	IEEE Xplore Digital Library
Author	Chen Ning Xiao-song Ma Jiang Haihua
Copyright Year	2008
Description	Author affiliation: Guilin Univ. of Electron. Technol., Guilin (Chen Ning; Xiao-song Ma; Jiang Haihua)
Abstract	In this paper, a humidity absorption test experiment is carried out under the temperature 20degC, 40degC and 60degC respectively and the environmental humidity was changed in different modes in each case. The experimental sample is from material of DA, and it is 14.5times5.5times0.37 $mm^{3}$ in size, and 94.4 mg in weight. The experiment data are collected to gain the saturated moisture. The moisture diffusion coefficient (D) of the sample can be calculated by fitting the line of data curve and calculating the slope of the line. The constants $(Q_{D}$ and $D_{0})$ which are in the Arrhenius formula are worded out by using the D [1]. In order to analyze the failure model in the interface between DA and die pad, a new type of system-in-package (SiP) is modeled. The simulation environments are set as the conditions of stored in the room temperature and processed in the SMT assembly production line. The analysis aim is to calculate the humidity distribution and the hygroscopic and thermal stress in these conditions. The results of FEM analysis shows that the max hygromechanical and thermo-mechanical stress appear in the corner of the interface between the Die and the DA, and the corner may be the risk location. The delamination may occur in this place. So it is necessary to analysis the reliability of the interface between the DA and others materials.
Starting Page	1
Ending Page	6
File Size	580024
Page Count	6
File Format	PDF
ISBN	9781424427390
DOI	10.1109/ICEPT.2008.4607086
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-07-28
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Stress Humidity Moisture Materials Plastics Temperature Thermal stresses
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in