NDLI: Study on no-fillet SMT solder joint reliability based on solder joint shape CAD

Content Provider	IEEE Xplore Digital Library
Author	Wu ZhaoHua Zhou DeJian Huang ChunYue
Copyright Year	2008
Description	Author affiliation: Sch. of Mech. & Electrial Eng., Guilin Univ. of Electron. Technol., Guilin (Wu ZhaoHua)
Abstract	Four process parameters including, the pad length, the pad width, the stencil thickness and the stand-off, are chosen as four control factors, and by using an $L_{25}(5^{6})$ orthogonal array, the no-fillet chip component solder joints shapes with 25 different process parameters combinations are established. And then all the shape prediction models of the 25 solder joints are built through the Surface Evolver soft, after that, the finite element analysis models are set up by converting the above ones. Afterwards, a non-linear finite element analysis on the no-fillet chip component solder joints under thermal cycles are performed by using ANSYS soft, and the thermal fatigue lifes of them are achieved through Coffin-Manson equation. Finally the variance analysis was performed based on the above lifes figures. The research show that with 95% confidence the stand-off has a significant effect on the reliability of the no-fillet chip component solder joints, whereas the pad length, the pad width and the stencil thickness have little effects on the reliability of the ones.
Starting Page	1
Ending Page	7
File Size	546838
Page Count	7
File Format	PDF
ISBN	9781424427390
DOI	10.1109/ICEPT.2008.4607023
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-07-28
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Shape Strain Analytical models Stress Mathematical model Finite element methods Reliability Solder joint shape No-fillet Process parameters Variance analysis
Content Type	Text
Resource Type	Article

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