NDLI: Corrosion performance of Pb-free Sn-Zn solders in salt spray

Content Provider	IEEE Xplore Digital Library
Author	Huang Dan Zhou Jian Li Pei Pei
Copyright Year	2008
Description	Author affiliation: Jiangsu Key Lab. of Adv. Metallic Mater., Southeast Univ., Nanjing (Huang Dan; Zhou Jian; Li Pei Pei)
Abstract	Environmental regulations around the world have been targeted to eliminate the usage of leaded solders in electronic assemblies. Sn-Zn based alloys are considered to be a very promising candidate for its substantially same melting point as Sn-Pb solder. Fujitsu Limited has developed several lead-free solders with low melting point such as Sn-7Zn-30 ppmAl and Sn-9Zn-30ppmAl. Those solders have already launched application to commercial products since 2002. A reliable solder material requires good corrosion resistance in various ambient conditions. In this research, the salt spray corrosion resistances of Sn-7Zn, Sn-9Zn, Sn-7Zn-30ppmAl and Sn-9Zn-30 ppmAl alloys were investigated by Salt Spray Tester according to the national standard GB/T2423.17-93. The surface microstructure features before and after corrosion was observed by optical microscopy and scanning electron microscopy (SEM) with energy dispersive analysis of X-ray (EDX) respectively. The results show that comparing with Sn-7Zn-XAl (X = 0, 30 ppm), the increase of zinc content in Sn-9Zn-XAl (X =0, 30 ppm) induces a decrease of corrosion resistance. The main corrosion mode of all solder alloys is intercrystalline corrosion. It was found that 30 ppm Al additive to the Sn-7Zn solder improves the corrosion behavior in the salt spray with dissolution rate decreasing. But the addition of 30 ppm Al has not too much influence on Sn-9Zn performance of corrosion resistance.
Starting Page	1
Ending Page	4
File Size	2959301
Page Count	4
File Format	PDF
ISBN	9781424427390
DOI	10.1109/ICEPT.2008.4607082
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-07-28
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Corrosion Metals Zinc Lead Resistance Tin Surface treatment salt spray corrosion Lead-free solders Sn-Zn Sn-Zn-Al
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Corrosion behavior of Sn-Zn-Bi and Sn-Pb-Ag solders in a salt spray test

Electrochemical behavior of Sn-xZn lead-free solders in aerated NaCl solution

Wetting and interfacial reactions of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder

Structural Aspects of the Behavior of Lead-Free Solder in the Corrosive Solution

INTERMETALLIC PHASE FORMATION AND THICKNESS OF TIN- ZINC BASED LEAD-FREE SOLDERS

An Evaluation of Fatigue Damage in Low-Cycle Range for Sn-3.5Ag, Sn-0.7Cu Lead-Free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature

Relationship Between Mechanical Properties of Lead-Free Solders and Their Heat Treatment Parameters

The corrosion performance of Zn-Al-Mg based alloys with tin addition in neutral salt spray environment

Effect of Ga on the Oxidation Properties of Sn–8.5Zn–0.5Ag–0.1Al–xGa Solders

Corrosion performance of Pb-free Sn-Zn solders in salt spray

Similar Documents

Corrosion behavior of Sn-Zn-Bi and Sn-Pb-Ag solders in a salt spray test

Electrochemical behavior of Sn-xZn lead-free solders in aerated NaCl solution

Wetting and interfacial reactions of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder

Structural Aspects of the Behavior of Lead-Free Solder in the Corrosive Solution

INTERMETALLIC PHASE FORMATION AND THICKNESS OF TIN- ZINC BASED LEAD-FREE SOLDERS

An Evaluation of Fatigue Damage in Low-Cycle Range for Sn-3.5Ag, Sn-0.7Cu Lead-Free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature

Relationship Between Mechanical Properties of Lead-Free Solders and Their Heat Treatment Parameters

The corrosion performance of Zn-Al-Mg based alloys with tin addition in neutral salt spray environment

Effect of Ga on the Oxidation Properties of Sn–8.5Zn–0.5Ag–0.1Al–xGa Solders

Corrosion performance of Pb-free Sn-Zn solders in salt spray