NDLI: Effects of Bi and Ni addition on wettability and melting point of Sn-0.3Ag-0.7Cu Low-Ag Pb-free solder

Content Provider	IEEE Xplore Digital Library
Author	Liu, Y. Sun, F.L. Yan, T.L. Hu, W.G.
Copyright Year	2008
Description	Author affiliation: Sch. of Mater. Sci. & Eng., Harbin Univ. of Sci. & Technol., Dongli (Liu, Y.; Sun, F.L.; Yan, T.L.; Hu, W.G.)
Abstract	Bi and Ni were added to Sn-0.3Ag-0.7Cu low-Ag solder, to fabricate new low-Ag solders, Sn-0.3Ag-0.7Cu-XBi (X= 1.0, 3.0, 4.5) and Sn-0.3Ag-0.7Cu-XNi (X=0.05, 0.10, 0.15). Melting point tests were carried out with DSC (differential scanning calorimetry) instrument. Wettability tests were conducted on a wetting balance instrument. Test results of the two new solders were compared with that of Sn-0.3Ag-0.7Cu respectively to study the effects of the adding elements on the melting point and wettability of the low-Ag Pb-free solder. It shows that Bi addition has striking positive effects on decreasing the melting point and improving wettability. Ni addition could improve the wettability as well, although not as much as Bi does. And Ni has a negative effect on melting point. With proper adding amount as X=3.0, Bi could significantly improve the wettability and decrease melting point at the same time. However, too much Bi addition could increase the melting range between liquidus and solidus, which may lead to the initiation of solidification crack of the solder joints.
Starting Page	1
Ending Page	4
File Size	392413
Page Count	4
File Format	PDF
ISBN	9781424427390
DOI	10.1109/ICEPT.2008.4607065
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-07-28
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bismuth Nickel Force Soldering Metals Lead Instruments
Content Type	Text
Resource Type	Article

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