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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Hongjun Ji Mingyu Li Chunqing Wang Jongmyung Kim Daewon Kim |
| Copyright Year | 2008 |
| Description | Author affiliation: Harbin Inst. of Technol., Shenzhen Univ., Shenzhen (Hongjun Ji; Mingyu Li) |
| Abstract | In this paper, the bond interface of Al-1 wt.%Si wire bonded on Au/Ni/Cu pad at atmosphere temperature was analyzed by using high resolution transmission electron microscopy. Nano-scale characteristics at bond interface indicated that elemental aluminum diffusing into gold layer was with the feature of step-level periodicity. Due to exceeding solid solubility limit, intermediate $Au_{8}Al_{3}$ phase penetrated among the Al-Au solid solutions. The diffusion distance was not more than 100 nm analyzed by energy X-ray dispersive spectrum. This process controlled by solid diffusion reaction was realized by the rapid and periodic ultrasonic vibration according to the theoretical calculation based on the Fickpsilas Law and the observation of the deformation twins among the bond wire and within the interfacial diffusion layer. |
| Starting Page | 1 |
| Ending Page | 5 |
| File Size | 402069 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424427390 |
| DOI | 10.1109/ICEPT.2008.4607055 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-07-28 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Gold Wire Acoustics Bonding Distance measurement Aluminum Solids |
| Content Type | Text |
| Resource Type | Article |
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