NDLI: Development of moisture automation analysis system for microelectronic packaging structures

Content Provider	IEEE Xplore Digital Library
Author	Yangjian Xia Yuanxiang Zhang Lihua Liang Yong Liu Irving, S. Luk, T.
Copyright Year	2008
Description	Author affiliation: Fairchild-ZJUT Microelectron. Packaging Joint Lab., Zhejiang Univ. of Technol., Hangzhou (Yangjian Xia; Yuanxiang Zhang; Lihua Liang)
Abstract	Moisture sensitivity of packages is an area of great concern for the electronics industry. The differential swelling of materials in a non-hermetic package during manufacture, handling, storage, assembly, and then also during its lifetime can cause stresses large enough to damage the package. A moisture automation analysis system is developed based on ANSYS Workbench and Excel platform in this paper. The goal of this paper is to develop an analysis system for moisture diffusion, hygro-mechanical stress and vapor pressure analysis automatically for different package family The application of moisture automation analysis system for moisture diffusion, vapor pressure diffusion, thermal-mechanical stress; hygro-mechanical stress; vapor equivalent thermal mismatch stress are performed. The comparisons of some results based on moisture automation analysis system with those from ANSYS are given. The results from this paper agree with those from pure ANSYS.
Starting Page	1
Ending Page	7
File Size	1372287
Page Count	7
File Format	PDF
ISBN	9781424427390
DOI	10.1109/ICEPT.2008.4606972
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-07-28
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Moisture Stress Solid modeling Finite element methods Automation Electronic packaging thermal management Analytical models
Content Type	Text
Resource Type	Article

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