NDLI: Fabrication and properties of SiC/Cu composites for electronic packaging

Content Provider	IEEE Xplore Digital Library
Author	Dezhi Zhu Gaohui Wu Guoqin Chen Qiang Zhang
Copyright Year	2005
Description	Author affiliation: Sch. of Mater. Sci. & Eng., Harbin Inst. of Technol., China (Dezhi Zhu; Gaohui Wu; Guoqin Chen; Qiang Zhang)
Abstract	The 55vol.% SiC/sub p//Cu composites with different particle sizes were fabricated by squeeze casting technology for electronic packaging applications, also with the effect of particle size and annealing treatment on their thermo-physical and mechanical properties are discussed. The microstructure observation showed the composites were dense and uniform as well as void free. The CTEs of SiC/sub p//Cu composites decreased with the reducing of SiC particle sizes, and it could be further reduced by annealing treatment. As the particle size increased, the thermal conductivities of SiC/sub p//Cu composites increased, which was similar to that after annealing. The SiC/sub p//Cu composites exhibited high bending strength and elastic modulus at ambient temperature. After annealing, the bending strength of composites decreased slightly, and the elastic modulus kept unchanged.
Starting Page	191
Ending Page	194
File Size	484498
Page Count	4
File Format	PDF
ISBN	0780394496
DOI	10.1109/ICEPT.2005.1564679
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-08-30
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fabrication Silicon carbide Electronics packaging Copper Thermal conductivity Casting Annealing Mechanical factors Microstructure Electronic packaging thermal management
Content Type	Text
Resource Type	Article

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