NDLI: Electrodeposition of palladium films on Ni-Co coatings

Content Provider	IEEE Xplore Digital Library
Author	Yanping He Dongyan Ding Xiang Gao Zhi Chen Ming Li Dali Mao
Copyright Year	2008
Description	Author affiliation: Sch. of Mater. Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai (Yanping He; Dongyan Ding; Xiang Gao)
Abstract	Co-Ni alloys have the properties of high hardness, good wear and corrosion resistance. A transition layer of Co-Ni coating will help enhance the hydrogen sensing stability of Pd films. In this work, Pd films were electrodeposited on Co-Ni coated copper substrate and silicon wafers. The influence of deposition parameters on the microstructure of Co-Ni coatings and Pd films were investigated. Experimental results indicated that scallop shell-like Co-Ni alloys could be fabricated on copper wafers. The tendency to form the shell-like deposits increased with increase of deposition time. While on silicon wafers, scallop shell-like Co-Ni alloys could not be fabricated. SEM and AFM analyses indicated that both composite films have a large surface area. Results showed that Pd films could be shaped by the prime films and thus maintain a large surface area.
Starting Page	1
Ending Page	5
File Size	2736068
Page Count	5
File Format	PDF
ISBN	9781424427390
DOI	10.1109/ICEPT.2008.4607048
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-07-28
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Films Surface treatment Surface morphology Metals Coatings Current density Surface roughness
Content Type	Text
Resource Type	Article

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