NDLI: New Nano-Thermal Interface Materials (Nano-TIMs) with SiC Nano-Particles Used for Heat Removal in Electronics Packaging Applications

Content Provider	IEEE Xplore Digital Library
Author	WenXuan Wang Xiuzhen Lu Liu, J. Olorunyomi, M.O. Aronsson, T. Dongkai Shangguan
Copyright Year	2006
Description	Author affiliation: Shanghai Univ., Shanghai (WenXuan Wang; Xiuzhen Lu; Liu, J.)
Abstract	Heat dissipation of semiconductor packages has become one of the limiting factors in miniaturization. A new Nano Thermal Interface Material (Nano-TIM) with potential high thermal conductivity and excellent mechanical properties manufactured by electrospinning process has been published earlier. In the present work, SiC nano-particles were added into the electrospinning solution to improve the thermal conductivity of the film. The produced Nano-TIM has a nano scale structure with embedded nano-SiC distributed randomly. Scanning Electrical Microscope (SEM) was used to determine the morphology of the film. Thermal properties were measured. The results show that the Nano-TIM has good thermal properties and it can be further improved by changing the mass concentration of the SiC nano particles.
Starting Page	1
Ending Page	5
File Size	1804547
Page Count	5
File Format	PDF
ISBN	9781424408337
DOI	10.1109/EMAP.2006.4430688
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-11
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Nanostructured materials Silicon carbide Electronics packaging Thermal conductivity Electronic packaging thermal management Conducting materials Semiconductor materials Scanning electron microscopy Semiconductor device packaging Mechanical factors
Content Type	Text
Resource Type	Article

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