NDLI: A simplified thermal resistance network model for high power LED street lamp

Content Provider	IEEE Xplore Digital Library
Author	Xiaobing Luo Wei Xiong Sheng Liu
Copyright Year	2008
Description	Author affiliation: Sch. of Energy & Power Eng., Huazhong Univ. of Sci. & Technol., Wuhan (Xiaobing Luo; Wei Xiong)
Abstract	Light emitting diode (LED) street lamp heavily relies on successful thermal management, which strongly affects the optical extraction and the reliability/durability of the LED lamp. In this study, a thermal resistance network model was presented to estimate the maximum heat sink temperature of the street lamp, which could be utilized to further evaluate the thermal performance of the street lamp. Two high power LED street lamps, an 114 watts and an 80 watts LED street lamp were used to evaluate the present model. Their heat sink temperatures were calculated by the model, the results showed that the maximum heat sink temperature was about 61degC at the environment temperature of 25degC for the 114 watts LED street lamp. For the 80 watts LED street lamp, the maximum heat sink temperature was about 42.5degC at the environment temperature of 11degC. To prove the model feasibility, experimental investigations on the 114 watts and 80 watts LED street lamp were conducted. The results demonstrated that the heat sink temperature of the 114 watts LED street lamp remained to be stable at about 60degC after several hourspsila lighting at the room temperature of 25degC. The heat sink temperature of the 80 watts LED street lamp remained to be stable at about 42degC at the room temperature of 11degC. Comparing the results achieved by the thermal resistance model with the experimental results, it was found that the proposed thermal resistance model could be used for temperature estimation and thermal evaluation for the high power street lamp.
Starting Page	1
Ending Page	7
File Size	675104
Page Count	7
File Format	PDF
ISBN	9781424427390
DOI	10.1109/ICEPT.2008.4606976
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-07-28
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Light emitting diodes Thermal resistance Heat sinks Resistance Electronic packaging thermal management Heat transfer Mathematical model
Content Type	Text
Resource Type	Article

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