NDLI: Novel low-temperature micro-insert bonding technology for 3D package

Content Provider	IEEE Xplore Digital Library
Author	Po Xu Anming Hu Zhuo Chen Ming Li Dali Mao
Copyright Year	2008
Description	Author affiliation: Sch. of Mater. Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai (Po Xu; Anming Hu; Zhuo Chen; Ming Li; Dali Mao)
Abstract	In this paper, a novel low-temperature micro-insert bonding technology for 3D package has been reported. Nickel microcone arrays (MCA) fabricated on the bonding pad was used as the under bump metallization (UBM). The bonding temperature is below the melting point of the solder. At certain temperature and pressure, the MCA inserted into the lead-free Sn-Ag-Cu solder bumps to achieve a good adhesion. The bonding of the joint is realized by the mechanical interlocking and the diffusion between the MCA and the solder. The nickel microcone arrays were prepared by directional electrodeposition (DEP) method on the Cu substrates in the solution with inorganic additives. And then hundreds of bumps were bonded on the substrates at different temperatures (150deg-210degC) and different bonding pressure (450, 560, 750 gf/p). Subsequently, ball shear testings were performed to evaluate the mechanical reliability and failure mode of the solder joints. After the shear testings, the microstructures of the fracture interfaces were investigated by SEM.
Starting Page	1
Ending Page	4
File Size	828454
Page Count	4
File Format	PDF
ISBN	9781424427390
DOI	10.1109/ICEPT.2008.4606956
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-07-28
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding Nickel Three dimensional displays Plasma temperature Packaging Surface treatment Copper
Content Type	Text
Resource Type	Article

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