NDLI: Thermal performance and reliability characterization of bonded interface materials (BIMs)

Content Provider	IEEE Xplore Digital Library
Author	DeVoto, D. Paret, P. Mihalic, M. Narumanchi, S. Bar-Cohen, A. Matin, K.
Copyright Year	2014
Description	Author affiliation: Defense Adv. Res. Projects Agency, Arlington, VA, USA (Bar-Cohen, A.; Matin, K.) \|\| Nat. Renewable Energy Lab., Golden, CO, USA (DeVoto, D.; Paret, P.; Mihalic, M.; Narumanchi, S.)
Abstract	Thermal interface materials (TIMs) are an important enabler for low thermal resistance and reliable electronics packaging for a wide array of applications. There is a trend towards bonded interface materials (BIMs) because of their potential for low thermal resistance (<;1 $mm^{2}-K/W).$ However, due to coefficient of thermal expansion mismatches between various layers of a package, thermomechanical stresses are induced in BIMs and the package can be prone to failures and integrity risks. Deteriorated interfaces can result in high thermal resistance in the package and degradation and/or failure of the electronics. The Defense Advanced Research Projects Agency's (DARPA) Thermal Management Technologies (TMT) Program has addressed this challenge, supporting the development of mechanically compliant, low resistivity nano-thermal interface (NTI) materials. Prior development of these materials resulted in samples that met DARPA's initial thermal performance and synthesis metrics. In this present work, we describe the testing procedure and report the results of thermal performance and reliability characterization of an initial sample set of three different NTI-BIMs tested at the National Renewable Energy Laboratory.
Starting Page	409
Ending Page	417
File Size	1101924
Page Count	9
File Format	PDF
ISBN	9781479952670
ISSN	10879870
DOI	10.1109/ITHERM.2014.6892310
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-05-27
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal resistance Electrical resistance measurement Materials Thermal conductivity Aging Temperature measurement steady-state technique thermal interface bonded interface material accelerated testing temperature cycling aging thermal resistance transient technique
Content Type	Text
Resource Type	Article

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