NDLI: Systematic evaluation of die thinning application in a power SIPs by simulation

Content Provider	IEEE Xplore Digital Library
Author	Yong Liu Desbiens, D. Irving, S. Timwah Luk Lolar, C. Yumin Liu Qiuxiao Qian
Copyright Year	2006
Description	Author affiliation: Fairchild Semicond., South Portland, ME (Yong Liu; Desbiens, D.; Irving, S.; Timwah Luk; Lolar, C.)
Abstract	In this paper, a lead frame based system in package (SIP) for power management is examined. This package is built using multiple die types including power IGBTs, diodes, and IC controllers. To maximize product performance the power components use an ultra thin back grind. Thin dies minimize RDS(on), maximize thermal performance, and minimize the board standoff height by allowing the package to be thinner. However, the ultra thin die could be a potential risk for die cracking if it is done without careful evaluation, especially for die thickness as thin as 90 mum and 50 mum. So it is critical to understand the impact of thinning dies on the reliability of the product in assembly manufacture and vary reliability tests. Modeling and simulation with a smaller amount of empirical testing is a good way to evaluate this thin die application quickly and at a lower cost. Therefore, the objective of this paper is to fully investigate the thin die application in a power SIP with systematic simulation and analysis before real application. A large complicated and advanced 3D FEA model framework is developed for the SIP. The major modeling and evaluation work is categorized into two areas: One is to check the impact of the thin die on different assembly processes. The other is to simulate the major reliability tests such as temperature cycle (TMCL) and component-level reflow process. Comprehensive evaluation and analysis of the modeling and simulation results for the thin die application to a Fairchild power SIP are presented
File Size	3228345
File Format	PDF
ISBN	1424401526
ISSN	05695503
DOI	10.1109/ECTC.2006.1645773
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Testing Power system modeling Semiconductor device modeling Assembly Analytical models Energy management Power system management Integrated circuit packaging Insulated gate bipolar transistors Diodes
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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