NDLI: Evaluation of DIG (direct immersion gold) as a new surface finishes for mobile applications

Content Provider	IEEE Xplore Digital Library
Author	Dongwook Kim Bhimaraj, P. Watts, N. Isao, Y. Kumar, C. Youren Xu
Copyright Year	2006
Description	Author affiliation: Intel Corp., Folsom, CA (Dongwook Kim; Bhimaraj, P.; Watts, N.; Isao, Y.; Kumar, C.; Youren Xu)
Abstract	DIG (direct immersion gold) is evaluated as an alternative surface finish solution to Ni/Au system for mobile electronics. Three key points are studied in this paper. First, Au capping layer optimization was studied. At least 0.14mum Au thickness is needed to prevent Cu out-diffusion and achieve reasonable assembly process window. Second, compared interfacial microstructures and morphologies of IMCs formed on DIG and Ni/Au surface finishes. DIG provide uniform IMC layer with no void, defect and Au-Sn intermetallic compounds (IMC). Finally, reliability and fracture modes were studied. SAC 405 performs better than eutectic Pb-Sn for the temperature cycling test. Crack in Pb-Sn + DIG system is initiated from interface of $Cu_{6}Sn_{5}$ and bulk solder and propagated to bulk solder while crack path of Pb-Sn + Electrolytic Ni/Au is interface of Au-Sn IMC and bulk solder. For drop test, SAC405 + DIG system has mix fracture modes of bulk and IMC brittle fracture while SAC405 + electrolytic Ni/Au has shows complete IMC fracture mode
File Size	1533469
File Format	PDF
ISBN	1424401526
ISSN	05695503
DOI	10.1109/ECTC.2006.1645656
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Gold Surface finishing Surface morphology Assembly Microstructure Surface cracks Intermetallic Performance evaluation Temperature Testing
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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