NDLI: A suggestion for high power LED package based on LTCC

Content Provider	IEEE Xplore Digital Library
Author	Jung Kyu Park Hyun Dong Shin Young Sam Park Sung Yeol Park Ki Pyo Hong Byung Man Kim
Copyright Year	2006
Description	Author affiliation: Opto Syst. Div., Samsung Electro-Mech., Gyunggi-do (Jung Kyu Park)
Abstract	A high power package based on LTCC, multi layer ceramic-metal package, MLCMP, has been proposed. To comply with recent demands for high power LEDs, the proposed package utilized large scale via slug for heat sink slug whose cross section area is greater than ordinary LED die size. The via slug could be constructed in a single tiring process. The matching quality at the ceramic-metal interface was acceptable for reliable LED package and thermal conductivity of the sintered silver was assumed to be nearly equivalent to bulk silver. Thus, the proposed MLCMP is equivalent to existing heat sink slug type packages, where the chip is located on the metal heat sink slug and heat is efficiently transmitted to circuit board by the aid of the heat sink slug. Thermal resistance of MLCMP was evaluated numerically and experimentally. In the numerical simulation, MLCMP was compared with conventional heat slug type package and aluminum nitride based package. Thermal resistance of all the three packages is less than 10 K/W. As the cross section of the via slug increases, thermal resistance of MLCMP exceeds those of the two other packages. A transient thermal analyzer was used to measure actual thermal resistance of working MLCMP. The measured data were compared with analytic solutions. Thermal resistance contributed to MLCMP has been revealed to be less than 1.0 K/W. Considering the affordability and design flexibility, we anticipate the proposed MLCMP is not only suitable for high power LED package but also a promising solution for illumination modules
File Size	545431
File Format	PDF
ISBN	1424401526
ISSN	05695503
DOI	10.1109/ECTC.2006.1645786
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Light emitting diodes Packaging Thermal resistance Heat sinks Thermal conductivity Silver Transient analysis Electrical resistance measurement Large-scale systems Printed circuits
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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