NDLI: Design and characterization of an integrated passive balun for quad band GSM applications

Content Provider	IEEE Xplore Digital Library
Author	Mondal, J. Li Li Drye, J.
Copyright Year	2006
Description	Author affiliation: Wireless & Mobile Syst. Group, Freescale Semicond. Inc., Lake Zurich, IL (Mondal, J.)
Abstract	In today's mobile phone application, more functionality and integration are expected in the front end RF sections, which include transceiver module, PA module, power management, digital processors, and others. In addition, package and module size, and form factor become an important aspect for these handhold applications. In this paper, we report the successful design of a smaller size, low loss, and cost effective dual balun for cell, EGSM, DCS & PCS bands (quad band) GSM/EDGE applications. The designed balun can be implemented onto a transceiver module's transmit (Tx) path. The integrated passive device (IPD) baluns show superior performance to commercially available discrete SMT baluns, with a much smaller size. Viable packaging approach is also explored to keep the cost and size low with hardly any penalty to electrical performance. The final smaller size balun design reduces die size, and hence die cost without sacrificing the performance. The size of the quad band GSM balun is 1.2mmtimes1.4mm. Measured insertion loss (IL) and return loss (RL) of the balun for low band - Tx and high band - Tx show IL < 0.8 dB, RL < 12dB. Measured amplitude & phase balance for low band - Tx show amplitude balance < plusmn 0.02 dB, and phase balance < plusmn 0.1 deg. For high band - Tx, amplitude balance < plusmn 0.03 dB, phase balance < plusmn 0.2 deg
File Size	2475442
File Format	PDF
ISBN	1424401526
ISSN	05695503
DOI	10.1109/ECTC.2006.1645700
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Impedance matching GSM Costs Transceivers Packaging Mobile handsets Radio frequency Energy management Distributed control Personal communication networks
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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