NDLI: New adhesive materials with improved thermal conductivity

Content Provider	IEEE Xplore Digital Library
Author	Grieve, A. Albert Capote, M. Soriano, A.
Copyright Year	2006
Description	Author affiliation: Aguila Technol., Inc., San Marcos, CA (Grieve, A.; Albert Capote, M.; Soriano, A.)
Abstract	There is increasing interest in the use of conductive polymeric adhesives as a replacement for soldering technology in electronic packaging applications. Relatively low cost, lower toxicity, reworkability and ease of processing make them an attractive alternative. To date, however, most conductive adhesives have certain critical limitations that inhibit their utility in many applications. We report on the development of new, low-temperature sintering adhesives that combine ease of processing of polymeric bonding materials with performance characteristics closer to solder. These new formulations incorporate novel fluxing polymeric resins in combination with a blend of metal alloy filler particles. During the cure process, the metal filler particles sinter together and are capable of forming "solder-like" metallurgical connections to a variety of metal surfaces resulting in lower and more stable thermal contact resistance values. These materials have both high electrical and thermal conductivity-closer to solder materials than most polymer-based materials but with the processing advantages of the best polymeric adhesives
File Size	656225
File Format	PDF
ISBN	1424401526
ISSN	05695503
DOI	10.1109/ECTC.2006.1645768
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal conductivity Conducting materials Polymers Electronic packaging thermal management Soldering Electronics packaging Costs Conductive adhesives Bonding Resins
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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