NDLI: High density vertical interconnects for 3-D integration of silicon integrated circuits

Content Provider	IEEE Xplore Digital Library
Author	Bower, C.A. Malta, D. Temple, D. Robinson, J.E. Coffinan, P.R. Skokan, M.R. Welch, T.B.
Copyright Year	2006
Description	Author affiliation: RTI Int., Research Triangle Park, NC (Bower, C.A.; Malta, D.; Temple, D.)
Abstract	This paper describes a technology platform being developed for three-dimensional (3-D) integration of thin stacked silicon integrated circuits (ICs). 3-D integration technology promises to dramatically enhance on-chip signal processing capabilities of a variety of sensor and actuator array devices hybridized with silicon read-out electronics. Currently, advanced 3-D integrated infrared focal plane array detectors are being developed within the DARPA vertically integrated sensor arrays (VISA) program. Here, we describe the 3-D integration process flow and demonstrations developed in the VISA program
File Size	1162962
File Format	PDF
ISBN	1424401526
ISSN	05695503
DOI	10.1109/ECTC.2006.1645677
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit interconnections Silicon Sensor arrays Integrated circuit technology Infrared sensors Infrared detectors Hybrid integrated circuits Array signal processing Sensor phenomena and characterization Actuators
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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