NDLI: Characterization of intermetallic compound formation and copper diffusion of copper wire bonding

Content Provider	IEEE Xplore Digital Library
Author	Zhang, S. Chen, C. Lee, R. Lau, A.K.M. Tsang, P.P.H. Mohamed, L. Chan, C.Y. Dirkzwager, M.
Copyright Year	2006
Description	Author affiliation: Center for Adv. Microsystems Packaging, Hong Kong Univ. of Sci. & Technol., Kowloon (Zhang, S.; Chen, C.; Lee, R.)
Abstract	The trend to replace Au and Al wires with Cu in wire bonding has become an emerging trend for IC packaging nowadays. Although some research works have been carried out for the applications of Cu wire bonding, they are mainly focused on the processing and material issues of Cu wire bonds. However, the Cu in the wire bonds may diffuse into the Si chip and impose reliability threats to the silicon devices. There is no study yet on the Cu-to-Si diffusion in Cu wire bonding. In the present study, the intermetallic compound (IMC) growth in the wire bond and the Cu-to-Si diffusion behavior are investigated. The correlation between IMC growth and Cu diffusion is established. From the experimental characterization, it is found that the IMC growth of Cu-Al is less severe than that of Au-Al. On the other hand, it is also found that the depth of Cu-to-Si diffusion is much larger than that of Au-to-Si. Furthermore, the barrier layer appears to be effective for reducing the Cu and Au diffusion depth in silicon. Nevertheless, it seems that the barrier layer also promotes the growth of IMC in the wire bond. Detailed comparison and discussion of results will be given
File Size	1032551
File Format	PDF
ISBN	1424401526
ISSN	05695503
DOI	10.1109/ECTC.2006.1645907
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Copper Intermetallic Wire Diffusion bonding Gold Diodes Optical microscopy Scanning electron microscopy Electronics packaging Integrated circuit packaging
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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