NDLI: Study of low-modulus die attach adhesives and molding compounds on warpage and damage of PBGA

Content Provider	IEEE Xplore Digital Library
Author	Sung Yi Daharwal, P.D. Lee, Y.J. Harkness, B.R.
Copyright Year	2006
Description	Author affiliation: Dept. of Mech. Eng., Portland State Univ., OR (Sung Yi)
Abstract	Numerical experiments based on the three-dimensional (3D) nonlinear finite element method (FEM) has been conducted to understand governing damage mechanisms during the die attachment for the ball grid array (BGA) packages. The parametric studies for various designs of the BGA package and material properties have been performed. A wide range of the modulus (1MPa~30GPa) and the coefficient of thermal expansion (CTE) (10ppm ~ 300ppm) were evaluated to see feasibility of a new class of material set in the die attach adhesive. Effects of thermo-mechanical properties, particularly glass transition temperature (Tg) of selected die attach adhesives on the damage and warpage of the die and substrate of BGA are analyzed. The warpage of substrate and Si die cracking due to the material properties of the die attach adhesive are demonstrated. Classification of modes of deformation in the BGA package with material sets will shed light on novel material development for better reliability. In addition, the optimum thermo-mechanical properties of die attachment materials and molding compounds will be selected based on the parametric studies
File Size	607911
File Format	PDF
ISBN	1424401526
ISSN	05695503
DOI	10.1109/ECTC.2006.1645767
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microassembly Parametric study Material properties Thermomechanical processes Finite element methods Electronics packaging Thermal expansion Glass Temperature Materials reliability
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Effects of low-modulus die attach adhesive on warpage and damage of BGA

Finite element analysis of substrate warpage during die attach process

Effect of heat slug and die attach material properties on plastic pin grid array (PPGA) package stress

Physical properties of low temperature solders and die attach materials

Assembly challenges for low modulus die attach material for MEMS devices

Die-attach materials for high-density memory stacked die packaging

Hygroscopic behavior and in-line thermo-mechanical treatment of polymeric material effects on PBGA warpage

The impact of die attach material on type II popcorn cracking

PBGA warpage and stress prediction for efficient creation of the thermomechanical design space for package-level reliability

Study of low-modulus die attach adhesives and molding compounds on warpage and damage of PBGA

Similar Documents

Effects of low-modulus die attach adhesive on warpage and damage of BGA

Finite element analysis of substrate warpage during die attach process

Effect of heat slug and die attach material properties on plastic pin grid array (PPGA) package stress

Physical properties of low temperature solders and die attach materials

Assembly challenges for low modulus die attach material for MEMS devices

Die-attach materials for high-density memory stacked die packaging

Hygroscopic behavior and in-line thermo-mechanical treatment of polymeric material effects on PBGA warpage

The impact of die attach material on type II popcorn cracking

PBGA warpage and stress prediction for efficient creation of the thermomechanical design space for package-level reliability

Study of low-modulus die attach adhesives and molding compounds on warpage and damage of PBGA