NDLI: Effect of thermal and electromigration exposure on solder joint board level drop reliability

Content Provider	IEEE Xplore Digital Library
Author	Luhua Xu Pang, J.H.L.
Copyright Year	2006
Description	Author affiliation: Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ. (Luhua Xu; Pang, J.H.L.)
Abstract	The combined sequential reliability test of thermal cycling aging or electromigration test followed by board level drop test for lead-free SnAgCu soldered assemblies were investigated. Interfacial IMCs, Kirkendall voids formation and interconnect failure mode are studied subject to TC aging and combined thermal-electromigration. Kirkendall voids were observed with Ar+ sputtering etching. The failure sites and mechanism were examined and correlated with IMC and void formation. Significant decrease of drop life was observed for both SAC/ENIG and SAC/Cu-OSP assemblies after thermal cycling aging. Growth of Kirkendall voids and IMC significantly weakened the solder joint interface during TC aging. Drop impact crack path changed from the IMC to the IMC/Cu interface
Starting Page	570
Ending Page	575
File Size	2485044
Page Count	6
File Format	PDF
ISBN	1424406641
DOI	10.1109/EPTC.2006.342776
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-06
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electromigration Soldering Aging Circuit testing Assembly Environmentally friendly manufacturing techniques Lead Integrated circuit interconnections Aerospace testing Sequential analysis
Content Type	Text
Resource Type	Article

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