NDLI: Bounding relations for natural convection heat transfer from vertical printed circuit boards

Content Provider	IEEE Xplore Digital Library
Author	Bar-Cohen, A.
Copyright Year	1963
Abstract	The simplicity and convenience of direct cooling with freely circulating air, as well as the ubiquity of such systems in the marketplace, make this the technique of choice for many thermal packaging tasks. While standard heat transfer correlations are generally unsuitable for determining the detailed thermal behavior of individual components, the maximum surface temperature of integrated circuit packages mounted on PCBs can often be shown to lie between two analytical bounds: an upper, "asymmetric isoflux," bound based on heat transfer from just one side of the PCB and a lower, "symmetric isoflux," bound based on identical thermal transport from both sides of each PCB. Following a brief review of the development and validation of the theoretical symmetric and asymmetric isoflux relations for smooth-plate channels, this study focuses on the application of the proposed bounding relations to widely and closely spaced component-carrying PCBs. Successful comparison with much of the available data demonstrates the acceptable accuracy of these analytical expressions, for all except the narrowest spacings, and their utility to the thermal designer of air-cooled PCBs.
Sponsorship	IEEE Publication
Starting Page	1388
Ending Page	1395
Page Count	8
File Size	736860
File Format	PDF
ISSN	00189219
Volume Number	73
Issue Number	9
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1985-09-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Heat transfer Printed circuits Electronic packaging thermal management Electronics cooling Thermal conductivity Temperature control Control systems Solid modeling Acceleration Thermal expansion
Content Type	Text
Resource Type	Article
Subject	Computer Science Electrical and Electronic Engineering

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