NDLI: Sn-Cu thin film transient liquid phase bonding test with different underlayers using fully-in-vacuum wafer aligner/bonder

Content Provider	IEEE Xplore Digital Library
Author	Hikichi, K. Matsuzaki, S. Nonomura, Y. Funabashi, H. Hata, Y. Esashi, M. Tanaka, S.
Copyright Year	2013
Description	Author affiliation: Micro Syst. Integration Center (μSIC), Tohoku Univ., Sendai, Japan (Hikichi, K.; Matsuzaki, S.; Esashi, M.; Tanaka, S.) \|\| Toyota Central R&D Labs., Inc., Nagakute, Japan (Nonomura, Y.; Funabashi, H.; Hata, Y.)
Abstract	This paper compares different diffusion barriers for thin film transient liquid phase (TLP) bonding. Thin film TLP bonding has some advantages such as low process temperature and a large tolerance of bonding surface roughness. However, metal diffusion phenomena in TLP bonding is so complicated that bonding strength is dependent on metal systems. In this study, Sn-Cu TLP system was selected and its bonding strengths with several diffusion barriers were evaluated by die shear test. The microstructure of the bonded metal part was examined by scanning electron microscopy and energy dispersive X-ray spectrometry. The diffusion barriers of multilayered Cu/Cr, Cr-Cu and Ni worked, and the best bonding strength was obtained using Au/Sn/Cu/Cr-Cu/Cr metal system (10/200/1000/100/100 nm), where Cu thickness is doubled compared with the other samples. This paper also describes a new wafer bonder in which alignment, surface treatment and bonding can be performed without breaking vacuum.
Starting Page	1071
Ending Page	1074
File Size	703236
Page Count	4
File Format	PDF
ISBN	9781467359832
ISSN	21641641
DOI	10.1109/Transducers.2013.6626956
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-06-16
Publisher Place	Spain
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding Tin Nickel Gold Sputtering Substrates Shear bonding strength Wafer-level packaging Transient liquid phase (TLP) bonding Copper tin Diffusion barrier
Content Type	Text
Resource Type	Article

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