NDLI: Fabrication of multi-layer vertically stacked fused silica microsystems

Content Provider	IEEE Xplore Digital Library
Author	Cao, Z. Yuan, Y. He, G. Peterson, R.L. Najafi, K.
Copyright Year	2013
Description	Author affiliation: Center for Wireless Integrated MicroSensing & Syst. (WIMS), Univ. of Michigan, Ann Arbor, MI, USA (Cao, Z.; Yuan, Y.; He, G.; Peterson, R.L.; Najafi, K.)
Abstract	In this paper, we present a fabrication process for an extremely compact, multi-layer, vertically-stacked fused silica microsystem. The system contains six fused silica layers in a total volume of less than 13 $mm^{3}.$ In the package are seven capacitive sensors designed as a six-degree of freedom inertial measurement unit plus a resonant timing device. Sixty-eight vertical electrical feedthroughs run through all six layers. Three key technologies are introduced: the fabrication of electrostatic devices on fused silica, the creation of through wafer vias in multiple layers of fused silica and stack bonding for 3-D integration of fused silica devices. The presented fused silica technology can be used for extreme miniaturization and integration of many future MEMS microsystems.
Starting Page	810
Ending Page	813
File Size	1551943
Page Count	4
File Format	PDF
ISBN	9781467359832
ISSN	21641641
DOI	10.1109/Transducers.2013.6626890
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-06-16
Publisher Place	Spain
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding Silicon compounds Gold Sensors Micromechanical devices inertial sensors Three-dimensional integration fused silica microsystem through wafer via
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
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3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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