NDLI: Fabrication of stress-induced self-rolled metal/insulator bifilm microtube with micromesh walls

Content Provider	IEEE Xplore Digital Library
Author	Lee, K.N. Seo, Y.T. Kim, J.-M. Kim, Y.-K. Lee, M.H. Seong, W.K.
Copyright Year	2013
Description	Author affiliation: Korea Electron. Technol. Inst. (KETI), Seongnam, South Korea (Lee, K.N.; Seo, Y.T.; Lee, M.H.; Seong, W.K.) \|\| Chonbuk Nat. Univ., Jeonju, South Korea (Kim, J.-M.) \|\| Seoul Nat. Univ., Seoul, South Korea (Kim, Y.-K.)
Abstract	A metal/insulator bifilm microtube with micromesh walls was constructed using a stress-assisted self-rolled-up technology. The $Pt/Ti/SiO_{2}$ microtube with mesh-sidewalls was self-formed by a tensile-stressed metal/insulator thin film through the release of planar micromesh from the silicon substrate by removing underlying sacrificial silicon structures. The metal pads interconnect electrically and support mechanically the freestanding self-rolled microtube. The electrical conductance was measured to show small thermal mass and good thermal isolation properties of the microtube. The diameter of self-rolled microtube is around 25 μm. The beam width and the size of micromesh walls were 0.6 μm and 5 μm, respectively. Thickness of Pt layer and $SiO_{2}$ layer was both 100 nm.
Starting Page	124
Ending Page	127
File Size	760356
Page Count	4
File Format	PDF
ISBN	9781467359832
ISSN	21641641
DOI	10.1109/Transducers.2013.6626717
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-06-16
Publisher Place	Spain
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Metals Silicon Insulators Substrates Fabrication Nanobioscience Three-dimensional displays Thin-film stress Microtube Micromesh Metal/insulator bifilms Self-rolling
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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