NDLI: Wafer-level thin film vacuum packages for MEMS using nanoporous anodic alumina membranes

Content Provider	IEEE Xplore Digital Library
Author	Zekry, J. Tezcan, D.S. Celis, J.-P. Puers, R. Van Hoof, C. Tilmans, H.A.C.
Copyright Year	2011
Description	Author affiliation: Imec, Kapeldreef 75, B-3001 Leuven, Belgium (Zekry, J.; Tezcan, D.S.; Puers, R.; Van Hoof, C.; Tilmans, H.A.C.) \|\| Katholieke Universiteit Leuven, Belgium (Celis, J.-P.)
Abstract	This paper reports on a wafer-level thin film vacuum packaging technology for MEMS. It is based on the fabrication of freestanding porous anodic alumina membranes of a typical thickness of 2 to 3µm, featuring cylindrical nanopores that are a mere 15–20nm in diameter (aspect ratio >100). The fabrication process involves in situ perforation of the thin AlOx barrier layer present at the bottom of the nanoporous membranes. For the present paper, a silicon oxide sacrificial layer and a vapor-phase HF release etch through the pores are utilized. The thin film packages are next sealed with a 4µm-thick PECVD nitride layer. Strong and “air-tight” thin film packages are obtained this way. Negligible impact on the RF transmission losses (up to 67GHz) is observed. A basic assessment of the package hermeticity based on the cap deflection method is also presented.
Starting Page	974
Ending Page	977
File Size	1697543
Page Count	4
File Format	PDF
ISBN	9781457701573
e-ISBN	9781457701566
DOI	10.1109/TRANSDUCERS.2011.5969507
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-06-05
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Micromechanical devices Packaging Cavity resonators Fabrication Atmospheric measurements Helium Radio frequency hermeticity MEMS packaging wafer-level encapsulation RF-MEMS porous anodic alumina
Content Type	Text
Resource Type	Article

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