NDLI: Mitigating lifetime underestimation: A system-level approach considering temperature variations and correlations between failure mechanisms

Content Provider	IEEE Xplore Digital Library
Author	Kai-Chiang Wu Ming-Chao Lee Marculescu, D. Shih-Chieh Chang
Copyright Year	2012
Description	Author affiliation: Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburgh, PA, USA (Marculescu, D.) \|\| Intel Corporation, Hillsboro, OR, USA (Kai-Chiang Wu; Ming-Chao Lee) \|\| Department of Computer Science, National Tsing Hua University, Hsinchu, Taiwan (Shih-Chieh Chang)
Abstract	Lifetime (long-term) reliability has been a main design challenge as technology scaling continues. Time-dependent dielectric breakdown (TDDB), negative bias temperature instability (NBTI), and electromigration (EM) are some of the critical failure mechanisms affecting lifetime reliability. Due to the correlation between different failure mechanisms and their significant dependence on the operating temperature, existing models assuming constant failure rate and additive impact of failure mechanisms will underestimate the lifetime of a system, usually measured by mean-time-to-failure (MTTF). In this paper, we propose a new methodology which evaluates system lifetime in MTTF and relies on Monte-Carlo simulation for verifying results. Temperature variations and the correlation between failure mechanisms are considered so as to mitigate lifetime underestimation. The proposed methodology, when applied on an Alpha 21264 processor, provides less pessimistic lifetime evaluation than the existing models based on sum of failure rate. Our experimental results also indicate that, by considering the correlation of TDDB and NBTI, the lifetime of a system is likely not dominated by TDDB or NBTI, but by EM or other failure mechanisms.
Starting Page	1269
Ending Page	1274
File Size	304463
Page Count	6
File Format	PDF
ISBN	9781457721458
ISSN	15301591
DOI	10.1109/DATE.2012.6176687
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-03-12
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	European Design Automation Association (EDAA)
Subject Keyword	Failure analysis Mathematical model Reliability Correlation Joints Benchmark testing Equations
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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