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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Chenying Yang Wei Wang Zhihong Li |
| Copyright Year | 2009 |
| Description | Author affiliation: Institute of Microelectronics, National Key Laboratory of Micro/Nano Fabri-cation Technology, Beijing, 100871, China (Wei Wang; Zhihong Li) || School of Public Health, Peking University Health Science Centre, Beijing, 100191, China (Chenying Yang) |
| Abstract | Presently, inexpensive hand-held corona system has been widely used as an alternative for PDMS-PDMS bonding, considering the fact that it is both effective and highly portable. In the present work, to optimize this corona-triggered bonding technique, different PDMS curing conditions and corona exposure time have been tested. The hydrophobic recovery of the corona treated PDMS surface was quantitatively studied by measuring the contact angle. Meanwhile, bonding strength was preliminarily evaluated through manually peeling. According to the present experimental results, layers of PDMS should be cured at 60°C for 60 minutes with the base-to-cure ratio of 10:1. Results of contact angle analysis indicate that hydrophobic recovery is generally the same between the surface of corona-treated PDMS and oxygen-plasma-treated PDMS. However, corona-treated PDMS has the unique advantage that within the first 30 minutes, sometimes even 1h, it can still be peeled off and rebonded without obvious bonding strength degradation. This may be of significant importance in the multi-layer PDMS bonding process, which requires accurate alignment between different layers. Furthermore, bonding of PDMS chips with a minimum feature size of 2µm has been demonstrated using the optimized corona-triggered PDMS-PDMS bonding technique. A long and narrowly shaped microfluidic chip has been sealed successfully in which no noticeable leakage was observed with a flow rate up to 1µL/s. |
| Starting Page | 319 |
| Ending Page | 322 |
| File Size | 9006982 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424446292 |
| DOI | 10.1109/NEMS.2009.5068586 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-01-05 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Optimization methods Bonding PDMS to PDMS bonding corona contact angle microfluidics |
| Content Type | Text |
| Resource Type | Article |
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