NDLI: The Effects of Driving Waveform of Piezoelectric Industrial Inkjet Head for Fine Patterns

Content Provider	IEEE Xplore Digital Library
Author	Youngjae Kim Wonchul Sim Changsung Park Youngseuck Yoo Jaewoo Joung Yongsoo Oh
Copyright Year	2006
Description	Author affiliation: eMD Lab. Central R&D Inst., Suwon (Youngjae Kim; Wonchul Sim; Changsung Park; Youngseuck Yoo; Jaewoo Joung; Yongsoo Oh)
Abstract	This paper presents the effect of driving waveform for piezoelectric bend mode inkjet printhead with optimized mechanical design. Experimental and theoretical studies on the applied driving waveform versus jetting characteristics were performed. The inkjet head has been designed to maximize the droplet velocity, minimize voltage response of the actuator and optimize the firing frequency to eject ink droplet. The head design was carried out by using mechanical simulation. The printhead has been fabricated with Si(100) and SOI wafers by MEMS process and silicon direct bonding method. To investigate how performance of the piezoelectric ceramic actuator influences on droplet diameter and droplet velocity, the method of stroboscopy was used. Also we observed the movement characteristics of PZT actuator with LDV(laser doppler vibrometer) system, oscilloscope and dynamic signal analyzer. Missing nozzles caused by bubbles in chamber were monitored by their resonance frequency. Using the water based ink of viscosity of 4.8 cps and surface tension of 0.025N/m, it is possible to eject stable droplets up to 20kHz, 4.4m/s and above 8pL at the different applied driving waveforms.
Starting Page	826
Ending Page	831
File Size	5471808
Page Count	6
File Format	PDF
ISBN	1424401399
DOI	10.1109/NEMS.2006.334905
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-01-18
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Design optimization Actuators Ink Voltage Firing Frequency Micromechanical devices Silicon Wafer bonding Ceramics droplet waveform inkjet head MEMS piezoelectric
Content Type	Text
Resource Type	Article

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