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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Yingchun Liang Degang Li Qingshun Bai Shumei Wang Mingjun Chen |
| Copyright Year | 2006 |
| Description | Author affiliation: Sch. of Mechatronics Eng., Harbin Inst. of Technol. (Yingchun Liang; Degang Li; Qingshun Bai; Shumei Wang; Mingjun Chen) |
| Abstract | For better understanding of the essential removal mechanisms of brittle material and stress distribution at high speed and ultrasonic elliptical vibration assisted cutting conditions at the atomic level, the single crystal silicon, expected as a next generation semiconductor material for wide band cap, high-voltage and low-loss power devices, MEMS components and so on, is analyzed by molecular dynamics computer simulation for its nanometer behavior through cutting force and subsurface stress distribution in the condition of similar ultrasonic elliptical vibration cutting. In this simulation, the cutting tool is assumed to be one of rigid single crystal diamond. The atomic behavior in a plane corresponding to Silicon (100) plane is simulated for dealing with a plane strain problem where the three-dimensional effect of inter-atomic force is considered. The results show that the cutting forces varies following a similar sinusoid different from the conventional cutting and the atomic layers below the machined surface are deformed and have residual stress |
| Starting Page | 635 |
| Ending Page | 638 |
| File Size | 4208625 |
| Page Count | 4 |
| File Format | |
| ISBN | 1424401399 |
| DOI | 10.1109/NEMS.2006.334862 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2006-01-18 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Semiconductor materials Stress Silicon Computational modeling Atomic layer deposition Crystalline materials Ultra wideband technology Micromechanical devices Computer simulation Nanoscale devices eliptical vibration cutting molecular dynamics stress distribution |
| Content Type | Text |
| Resource Type | Article |
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