NDLI: A New Packaging Method for Pressure Sensors by PDMS MEMS Technology

Content Provider	IEEE Xplore Digital Library
Author	Wang, H.-H. Yang, P.-C. Liao, W.-H. Yang, L.-J.
Copyright Year	2006
Description	Author affiliation: Dept. of Mech. & Electro-Mech. Eng., Tamkang Univ., Tamsui (Wang, H.-H.; Yang, P.-C.; Liao, W.-H.; Yang, L.-J.)
Abstract	This paper proposes a novel wafer-level packaging (WLP) method at room temperature for piezoresistive pressure sensors. We use a polydimethylsiloxane (PDMS) sheet as a candidate for replacing a Pyrex glass wafer, to seal the backside V-grooved chambers of the pressure sensor chips. PDMS is a well-known material in MEMS technology recently. It is not only cheap but also has a merit of a simple process. We also fabricated piezoresistive pressure sensors, made by the same batch, with different packaging materials of Pyrex glass and PDMS sheet in the paper, respectively. The spin-coating approach is accessed to control the thickness of PDMS by applying the silicon and Teflon disks, as the supporting substrates during the formation of PDMS sheets. The sensors packaged by the PDMS room temperature bonding herein almost have the same performance as the ones packaged by the conventional anodic bonding through the real verification of pressure testing
Starting Page	47
Ending Page	51
File Size	4081477
Page Count	5
File Format	PDF
ISBN	1424401399
DOI	10.1109/NEMS.2006.334619
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-01-18
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Packaging Micromechanical devices Temperature sensors Wafer scale integration Piezoresistance Glass Sheet materials Bonding Seals Thickness control pressure sensor PDMS package piezoresistive
Content Type	Text
Resource Type	Article

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