NDLI: Investigation of thermal type microsensor with infrared photonic crystal

Content Provider	IEEE Xplore Digital Library
Author	Po-Hao Hsu Meng-Hung Tsai Chih-Hsiung Shen Shu-Jung Chen
Copyright Year	2010
Description	Author affiliation: Department of Mechatronics Engineering, National Changhua University of Education, NO. 2, Shi-Da Road, Taiwan, R.O.C. (Po-Hao Hsu; Meng-Hung Tsai; Chih-Hsiung Shen; Shu-Jung Chen)
Abstract	In this paper we have proposed a new complementary metal-oxide-semiconductor (CMOS) thermopile by leading the infrared photonic crystal (IPC) to increase the absorption of infrared radiation. A highly sensitive infrared detector requires an excellent signal induced by incident IR radiation to maximize the temperature change. A photonic crystal structure offers significantly effects of optical performance, especially for the absorption and emitting of radiation. Firstly we develop such a structure of thermopile with high performance by using 0.35µm 2P4M CMOS IC compatible process which can be easily and exactly fabricated. Several designs of infrared microsensors are proposed to study influential parameters from the photonic crystal structure. The measurement results show these devices get greatly responses higher than the thermopile without infrared photonic crystal. To that end, the investigation of field of view for our proposed thermopile is acquired, and the results show no significant difference between the thermopiles with or without PC. Our design is proved to be adequate for commercial batch production.
Starting Page	829
Ending Page	832
File Size	944812
Page Count	4
File Format	PDF
ISBN	9781424481705
ISSN	19300395
e-ISBN	9781424481699
e-ISBN	9781424481682
DOI	10.1109/ICSENS.2010.5691008
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-11-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Photonic crystals Etching CMOS integrated circuits Sensors Absorption Fabrication Silicon
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

A new approach of thermal type microsensor with photonic crystal

Thermoelectric infrared sensors by CMOS technology

An offset reduction infrared tracking system with winner-take-all implementation for CMOS thermal microsensor

2.5D-surface-operation photonic-crystal III-V on silicon based lasers for photonic integrated circuits and sensing applications

CMOS membrane infrared sensors and improved TMAHW etchant

Integrated micromachined decoupled CMOS chip on chip

Surface Morphology Measurement and Investigation of A New CMOS Compatible Thermopile with High Fill Factor

Silicon technology for photonic crystal- and nanowire devices

Realization of high aspect ratio nanopillar type photonic crystal by deep reactive ion etching

Investigation of thermal type microsensor with infrared photonic crystal

Similar Documents

A new approach of thermal type microsensor with photonic crystal

Thermoelectric infrared sensors by CMOS technology

An offset reduction infrared tracking system with winner-take-all implementation for CMOS thermal microsensor

2.5D-surface-operation photonic-crystal III-V on silicon based lasers for photonic integrated circuits and sensing applications

CMOS membrane infrared sensors and improved TMAHW etchant

Integrated micromachined decoupled CMOS chip on chip

Surface Morphology Measurement and Investigation of A New CMOS Compatible Thermopile with High Fill Factor

Silicon technology for photonic crystal- and nanowire devices

Realization of high aspect ratio nanopillar type photonic crystal by deep reactive ion etching

Investigation of thermal type microsensor with infrared photonic crystal